THERMALLY CONDUCTIVE MEMBER, MICROPROCESSOR AND ELECTRONIC DEVICE,申请号JP20080237900-传众专利搜索

THERMALLY CONDUCTIVE MEMBER, MICROPROCESSOR AND ELECTRONIC DEVICE

申请公布号：JP2010073790(A)

申请号：JP20080237900

申请日期：2008.09.17

申请公布日期：2010.04.02

申请人：

NITTO DENKO CORP

发明人：TERADA YOSHIO;WANO TAKASHI;NAKAYAMA JUNICHI;NAITO TOMOYA;OKADA MIYOSHI

分类号：H05K7/20;C08F2/44;C08K3/00;C08L101/00;H01L23/36;H01L23/373

主分类号：H05K7/20

摘要：<P>PROBLEM TO BE SOLVED: To provide a thermally conductive member which is excellent in both heat conductivity and adhesion, and to provide a microprocessor and an electronic device. Ž<P>SOLUTION: In the microprocessor 1 comprising a heat spreader 5, a heat sink 7 disposed facing the heat spreader 5 and a second heat conductive member 6 interposed between the heat spreader 5 and the heat sink 7, the second heat conductive member 6 includes an inorganic-polymer composite material for which a hydrophilic inorganic compound with a maximum length of 1 to 1,000 nm is unevenly distributed on the surface of polymer particles whose median diameter of volume reference is 0.05 to 100 μm. In the inorganic-polymer composite material forming the second heat conductive member 6, the hydrophilic inorganic compound is unevenly distributed on the surface of the polymer particles. Thus, in the microprocessor 1 with the second heat conductive member 6, heat is efficiently discharged by efficiently discharging heat conducted to the heat spreader 5 to the heat sink 7 by the second heat conductive member 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž