LEAD SOLDER-FREE ELECTRONICS,申请号WO2009US54535-传众专利搜索

LEAD SOLDER-FREE ELECTRONICS

申请公布号：WO2010030487(A1)

申请号：WO2009US54535

申请日期：2009.08.20

申请公布日期：2010.03.18

申请人：

LOCKHEED MARTIN CORPORATION;ZINN, ALFRED, A.

发明人：ZINN, ALFRED, A.

分类号：B32B15/02

主分类号：B32B15/02

摘要：<p>A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220 0C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.</p>