LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD

申请公布号：JP2010029928(A)

申请号：JP20080197226

申请日期：2008.07.31

申请公布日期：2010.02.12

申请人：

DISCO ABRASIVE SYST LTD

发明人：HAMAMOTO TOMOSABURO;NOMURA HIROSHI

分类号：B23K26/38;B23K26/10;B23K26/40;H01L21/301

主分类号：B23K26/38

摘要：<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method in which a workpiece is held without touching a device forming region and capable of emitting a laser beam from the rear face side, and in which a reformed layer can be formed accurately on a workpiece even with a warp therein. <P>SOLUTION: An excess region 10b which is provided in the periphery of the surface of a workpiece 10 and which has no device 10a formed in is sucked and held by means of an annular holding face 21a installed in the holder 21 of a holding means 20 and inclined inward radially. Then, a laser beam 5 having a wavelength passing through the workpiece 10 and an adhesive tape 12 is emitted from the rear face side of the workpiece 10 along a planned dividing line, on a converging point inside the workpiece 10 by a laser beam irradiation means 3, and a reformed region is formed inside the workpiece 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>