PHYSICAL QUANTITY SENSOR AND MANUFACTURING METHOD THEREOF,申请号JP20080189025-传众专利搜索

PHYSICAL QUANTITY SENSOR AND MANUFACTURING METHOD THEREOF

申请公布号：JP2010025822(A)

申请号：JP20080189025

申请日期：2008.07.22

申请公布日期：2010.02.04

申请人：

ALPS ELECTRIC CO LTD

发明人：KIKUIRI KATSUYA;SATO KIYOSHI;SAKURAI MASARU

分类号：G01L9/00;H01L23/14;H01L23/15;H01L25/065;H01L25/07;H01L25/18;H01L29/84

主分类号：G01L9/00

摘要：PROBLEM TO BE SOLVED: To provide a physical quantity sensor and a manufacturing method thereof which particularly enable reduction of a stress caused by a thermal expansion difference from a circuit board and working on a silicon substrate and moreover enable simple and adequate confirmation of soldering of a pressure sensor on the circuit board, and also to provide an installation structure of the physical quantity sensor. SOLUTION: The sensor has silicon substrates 2 and 3, a displacement part (diaphragm) 8 formed in the silicon substrates 2 and 3, a detecting element for detecting a displacement amount of the displacement part, an electrode pad 11 connected electrically to the detecting element and formed on the silicon substrates, and an interposer 15 joined to the electrode pad 11. The interposer 15 is constituted by having a support base 17, a continuity part 18 formed from a joining surface (first surface) with the electrode pad 11 to a second surface, and a solder fillet forming part 22 connected electrically to the second surface side of the continuity part 18 and so formed as to be exposed on the lateral side. COPYRIGHT: (C)2010,JPO&INPIT