MIXED ANALOG AND DIGITAL INTEGRATED CIRCUITS,申请号KR20097013686-传众专利搜索

MIXED ANALOG AND DIGITAL INTEGRATED CIRCUITS

申请公布号：KR100940404(B1)

申请号：KR20097013686

申请日期：2002.02.22

申请公布日期：2010.02.02

分类号：H01L25/18;H01L23/31;H01L25/065;H01L25/07

主分类号：H01L25/18

摘要：Techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits. In one aspect, the analog and digital circuits are implemented on two separate dies using possibly different IC processes suitable for these different types of circuits. The analog and digital dies are thereafter integrated (stacked) and encapsulated within the single package. Bonding pads are provided to interconnect the dies and to connect the dies to external pins. The bonding pads may be located and arranged in a manner to provide the required connectivity while minimizing the amount of die area required to implement the pads. In another aspect, the die-to-die connectivity may be tested in conjunction with a serial bus interface.