Stackable semiconductor package having metal pin within through hole of package,申请号US20070808129-传众专利搜索

Stackable semiconductor package having metal pin within through hole of package

申请公布号：US7656031(B2)

申请号：US20070808129

申请日期：2007.06.06

申请公布日期：2010.02.02

申请人：

BRIDGE SEMICONDUCTOR CORPORATION

发明人：CHEN CHENG-CHUNG;WANG CHIA-CHUNG;TAN CHIN HOCK;LIN CHARLES W. C.

分类号：H01L23/12

主分类号：H01L23/12

摘要：The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.