Plating bath and surface treatment compositions for thin film deposition

申请公布号：US7655081(B2)

申请号：US20060433825

申请日期：2006.05.15

申请公布日期：2010.02.02

申请人：

SILURIA TECHNOLOGIES, INC.

发明人：DAI HAIXIA;PAKBAZ KHASHAYAR;SPAID MICHAEL;NIKIFOROV THEO

分类号：C23C18/34;C23C18/36

主分类号：C23C18/34

摘要：An aqueous substrate surface treatment composition includes cysteine and an acidic solution having a pH of about 7 or less. The composition enables a selective deposition of a metal ion sensitizer and a subsequent selective plating of a metallic cap layer. Various CoWP plating bath compositions are also provided which may be used to form the cap layer.

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