POSITIVE PHOTOSENSITIVE RESIN COMPOSITION,申请号US20060091122-传众专利搜索

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

申请公布号：US2009233228(A1)

申请号：US20060091122

申请日期：2006.10.20

申请公布日期：2009.09.17

申请人：

ASAHI KASEI EMD CORPORATION

发明人：SHIBUI SATOSHI

分类号：G03F7/004;G03F7/20;H01L23/29

主分类号：G03F7/004

摘要：The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.