分离和组装半导体细长条
申请公布号:CN100499061C
申请号:CN200480012557.1
申请日期:2004.05.07
申请公布日期:2009.06.10
发明人:保罗·C.·王;瑞兹米克·艾博努斯;韦尔尼·A.·埃弗雷特;马克·J.·克尔
分类号:H01L21/68(2006.01)I
主分类号:H01L21/68(2006.01)I
代理人:杜日新
地址:澳大利亚南澳大利亚
摘要:公开了用于从晶片(400)分离出细长半导体条(630)的一种方法和设备。真空(500)抽吸形成晶片(400)边缘或邻接边缘的每条半导体长条的面。使晶片(400)和真空(500)的源位移以便从晶片(400)分离出各条细长半导体条(630)。而且,公开了用于把从半导体材料的晶片(400)分离出的细长半导体条(630)组装成细长条(630)阵列的一种方法和设备。再进一步,还公开了用于在衬底上组装细长半导体条(630)阵列的一些方法、设备和系统。
主权项:1. 一种从半导体材料的晶片分离出细长半导体条的方法,上述方法包括以下步骤:构成在晶片内以基本上互相平行方式形成的多个细长半导体条,上述晶片具有基本上是平面的表面、在与基本上是平面的表面成直角处的厚度尺寸和在上述半导体细长条两端上使上述细长条与上述晶片连接的框架部分,上述半导体细长条各具有至少基本上等于晶片厚度的宽度且细长条的厚度尺寸小于上述宽度,其中至少一条细长半导体条的面在长度方向上形成上述晶片的边缘或者紧靠上述边缘;真空抽吸形成上述边缘或邻接上述边缘的上述细长半导体条;和使上述晶片和上述真空的源互相相对位移一段预定的距离,从上述晶片分离出使用真空抽吸的上述细长半导体条。
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