HEAT RESISTANT FRICTION PLATE MATERIAL AND METHOD FOR MANUFACTURING THE SAME

申请公布号：JP2009114379(A)

申请号：JP20070290829

申请日期：2007.11.08

申请公布日期：2009.05.28

申请人：

KYOCERA CHEMICAL CORP

发明人：KINAMI YU;UCHIDA NOBUHIKO

分类号：C09K3/14;C08J5/14;C08K3/00;C08L63/00;C08L79/08

主分类号：C09K3/14

摘要：PROBLEM TO BE SOLVED: To provide a heat resistant friction plate material having stable friction coefficient at ordinary or even high temperature and high durability and keeping reliability through a long period. SOLUTION: In the heat resistant friction plate obtained by impregnating a sheet-like base material with a polyamideimide resin composition and heating and curing, the polyamideimide resin composition contains (A) a polyamideimide resin, (B) an epoxy resin and (C) an inorganic filler as inevitable components wherein the 5% mass-reducing temperature of a cured product is≥400°C. COPYRIGHT: (C)2009,JPO&INPIT

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