FLEXIBLE WIRING BOARD FOR TAPE CARRIER PACKAGE,申请号KR20080065073-传众专利搜索

FLEXIBLE WIRING BOARD FOR TAPE CARRIER PACKAGE

申请公布号：KR20090004767(A)

申请号：KR20080065073

申请日期：2008.07.04

申请公布日期：2009.01.12

申请人：

UBE INDUSTRIES, LTD.

发明人：TAKASAWA RYOICHI;KOHAMA YUKINORI;NAIKI MASAHIRO

分类号：H05K1/02;B65D73/02;B65D85/86

主分类号：H05K1/02

摘要：A flexibility wiring board for a tape carrier package is provided to reduce the stickiness of an overcoat layer surface by including a porous particle in a cured resin. A flexibility wiring board for a tape carrier package comprises an insulating film(1), and a wiring pattern(3) and an overcoat layer(9). The wiring pattern is formed in the surface of the insulating film. The overcoat layer comprises a cured resin and a porous particle The porous particle is included with the rate of 0.1~50 wt.% corresponding to 100 wt.% of the cured resin. An overcoat layer protects a part of the wiring pattern.