CHIP-FILM ASSEMBLY AND MANUFACTURING METHOD OF THE SAME,申请号KR20060119167-传众专利搜索

CHIP-FILM ASSEMBLY AND MANUFACTURING METHOD OF THE SAME

申请公布号：KR100873444(B1)

申请号：KR20060119167

申请日期：2006.11.29

申请公布日期：2008.12.11

分类号：H01L23/48

主分类号：H01L23/48

摘要：<p>A chip-film assembly and a manufacturing method of the same are provided to connect a wiring and a circuit pattern to each other by forming a connective pattern. A chip(30) is mounted on a film body(10). The chip includes a circuit pattern(32) oriented to the outside. A wiring(40) is formed on the film body. A connective pattern(50) is formed to be connected the wiring and the circuit pattern to each other. The connective pattern and the wiring are formed with one body. The film body is a polyimide film. The wiring and the connective pattern are composed of copper. An adhesive layer(21) is formed between the film body and the chip. A through-hole(11) is formed at the film body. The circuit patterns are formed on both sides of the film body. The circuit patterns are electrically connected with each other through the through-hole.</p>