VORRICHTUNG UND VERFAHREN ZUR HERMETISCHEN ABDICHTUNG EINES HOHLRAUMS IN EINEM ELEKTRONISCHEN BAUTEIL
申请公布号:AT413363(T)
申请号:AT20050824668T
申请日期:2005.12.13
申请公布日期:2008.11.15
发明人:LAI, AYMERIC
分类号:B81C3/00;H01L23/28
主分类号:B81C3/00
摘要:To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the cavity. The sealing device includes a cavity permitting the cavity of the microelectronic component to be filled. The sealing device slides along the component so as to be positioned opposite either the filling cavity, or the cap.
RECORD PLAYER OF CARTRIDGE SELFFRUNNING TYPE
COLOR DISPLAY SYSTEM USING MAGNETOOOPTICAL SCREEN HAVING DISPERSIVE FARADAY COEFFICIENT
TIMER DEVICE FOR ELECTRIC WASHING MACHINE
FILTRATION PLANT ELECTRICITYYRETURN TREATMENT SYSTEM
METHOD OF EXECUTING FIREPROOF COATED MORTAR WALL
BALANCING APPARATUS FOR ELEVATOR
FRONTTFORK STYLEESTRIP MOUNTING STRUCTURE OF AUTOBICYCLE
SERIESSTRIM COMBINATION ACTUATOR OF AIRCRAFT AUTOMATIC STABILIZING SYSTEM
PLURAL LINES SIMULTANEOUS READ METHOD OF INFORMATION
WAFER POSITION DETECTION METHOD AND ITS UNIT