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VORRICHTUNG UND VERFAHREN ZUR HERMETISCHEN ABDICHTUNG EINES HOHLRAUMS IN EINEM ELEKTRONISCHEN BAUTEIL

申请公布号:AT413363(T)

申请号:AT20050824668T

申请日期:2005.12.13

申请公布日期:2008.11.15

申请人:
COMMISSARIAT A L'ENERGIE ATOMIQUE;CENTRE NATIONAL D'ETUDES SPATIALES

发明人:LAI, AYMERIC

分类号:B81C3/00;H01L23/28

主分类号:B81C3/00

摘要:To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the cavity. The sealing device includes a cavity permitting the cavity of the microelectronic component to be filled. The sealing device slides along the component so as to be positioned opposite either the filling cavity, or the cap.

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