Dynamic film thickness control system/method and its utilization
申请公布号:US7435300(B2)
申请号:US20020277677
申请日期:2002.10.23
申请公布日期:2008.10.14
发明人:LING KOW-JE;JUANG JIUNN-SHIUH
分类号:H01L21/00;C23C14/00;C23C14/54;C23C16/00;C23C16/52;G01B11/02;G01B11/06;G01B15/02
主分类号:H01L21/00
摘要:A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.