MOLD PACKAGE AND ITS MANUFACTURING METHOD, AND MOUNTING STRUCTURE OF THE MOLD PACKAGE,申请号JP20070017553-传众专利搜索

MOLD PACKAGE AND ITS MANUFACTURING METHOD, AND MOUNTING STRUCTURE OF THE MOLD PACKAGE

申请公布号：JP2008186891(A)

申请号：JP20070017553

申请日期：2007.01.29

申请公布日期：2008.08.14

申请人：

DENSO CORP

发明人：ASAI SHOKI;OTA SHINJI;HONDA MASAHIRO

分类号：H01L23/50

主分类号：H01L23/50

摘要：<P>PROBLEM TO BE SOLVED: To reduce the concentration of stress in solder at the corner of a lead part exposing from a mold resin when a leadless type mold package is mounted by soldering. <P>SOLUTION: The mold package 100 is bonded to a substrate 200 on faces 12b and 12c exposing from a mold resin 30 at a lead part 12 by means of solder 300. In the exposed faces 12b and 12c in the lead part 12, a corner 12d that is formed by an end face 12c exposing from the end face 33 of the mold resin 30 and a lower face 12b exposing from the lower face 32 of the mold resin 30 is recessed. <P>COPYRIGHT: (C)2008,JPO&INPIT