Wiring board with built-in capacitor,申请号US20060474339-传众专利搜索

Wiring board with built-in capacitor

申请公布号：US7336501(B2)

申请号：US20060474339

申请日期：2006.06.26

申请公布日期：2008.02.26

申请人：

IBIDEN CO., LTD.

发明人：TANAKA HIRONORI

分类号：H05K1/16

主分类号：H05K1/16

摘要：The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area. The wiring board further includes: a line that electrically connects either one of a power pad for supplying power to the IC chip and a ground pad for grounding the IC chip to either one of the first lower electrode and the second lower electrode; and a line that electrically connects the other of the power pad and the ground pad to the other of the first upper electrode and the second upper electrode.