STRUCTURE FOR SEALING LIGHT-EMITTING DIODE CHIP AND METHOD THEREOF,申请号KR20070037879-传众专利搜索

STRUCTURE FOR SEALING LIGHT-EMITTING DIODE CHIP AND METHOD THEREOF

申请公布号：KR20070103319(A)

申请号：KR20070037879

申请日期：2007.04.18

申请公布日期：2007.10.23

申请人：

HARVATEK CORPORATION

发明人：WANG BILLY;CHUANG JONNIE;WU WEN KUEI

分类号：H01L23/28;H01L33/50;H01L33/62

主分类号：H01L23/28

摘要：A structure for sealing a light-emitting diode chip and a method of the same are provided to reduce a process time of manufacturing by packaging light emitting diode chips to form a continuous beam. A structure for sealing a light-emitting diode chip includes a base unit(1), a light emitting unit(2), and an enclosing unit(3). The base unit(1) has a main body of a base, a cathode conductive trace and an anode conductive trace formed on the main body of the base respectively. The light emitting unit(2) has a plurality of light emitted diode chips mounted on the main body of the base. The light emitted diode chips have a cathode conductive end and an anode conductive end. The cathode conductive end and the anode conductive end are connected to the cathode conductive trace and the anode conductive trace. The enclosing unit(3) encloses the base unit(1) and the light emitting unit(2). The light is guided to the enclosing unit(3) when the light is generated by conduction of the cathode and anode conductive traces.