MULTI-CHIP ELECTRONIC PACKEGE,申请号WO2006IB00526-传众专利搜索

MULTI-CHIP ELECTRONIC PACKEGE

申请公布号：WO2007102042(A1)

申请号：WO2006IB00526

申请日期：2006.03.09

申请公布日期：2007.09.13

申请人：

INFINEON TECHNOLOGIES AG;LIM, CHEE, CHIAN;HNG, MAY, TING

发明人：LIM, CHEE, CHIAN;HNG, MAY, TING

分类号：H01L25/16;H01L23/495

主分类号：H01L25/16

摘要：An electronic component (10) comprises lead fingers (2) and a die paddle (4) . A tape pad (1) is mounted below the lead fingers (2) and the die paddle (4) . A first semiconductor chip (3) is bonded onto the tape pad (1) by a layer of first adhesive (8) and a second semiconductor chip (5) is bonded onto the die paddle (4) by a layer of second adhesive (7) . Electrical contacts (11) are provided between the contact areas of the semiconductors (3) and (5) , and the lead fingers (2) . An encapsulating compound covers part of the lead fingers (2), the tape pad (1) , the semiconductor chips (3) and (5) and the electrical contacts (11) .