Thermal trip device and circuit breaker using the same
申请公布号:US2007195478(A1)
申请号:US20040592003
申请日期:2004.04.21
申请公布日期:2007.08.23
发明人:KAWAMURA KOUJI;AKITA HIROYUKI;MURAI MASATOSHI;YONEZAWA HIROTOSHI;NAITO SATORU
分类号:H02H5/04;H01H71/16;H01H73/02
主分类号:H02H5/04
摘要:A thermal trip device in which a bimetal ( 2 ) is heated by overcurrent and performs trip operation of a circuit by curvature of the heated bimetal ( 2 ), wherein at least one part of the surface of the bimetal ( 2 ) is made to be black or matte black ( 7 ). Thereby, temperature of the bimetal ( 2 ) can be highly accurately measured using a no-contact thermometer. Furthermore, a temperature measurement part ( 8 ) of the bimetal is provided with a bending part ( 11 ), and the surface of the bending part is made to be matte black.