MANUFACTURING METHOD OF FLEXIBLE POLYIMIDE PLATE LAMINATED WITH METAL FOIL

申请公布号：JP2007184405(A)

申请号：JP20060001394

申请日期：2006.01.06

申请公布日期：2007.07.19

申请人：

SHIN ETSU CHEM CO LTD

发明人：ASAZUMA JUN;USU MASAHIRO;HOSHIDA SHIGEHIRO;AMANO TADASHI

分类号：H05K3/00;B29C65/48;B32B15/08;B32B15/088;H05K1/03

主分类号：H05K3/00

摘要：PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible polyimide base plate laminated with a metal foil with no wrinkle and air bubbles, excellent in dimensional stability without causing warpage after removal of a copper foil. SOLUTION: The manufacturing method of the flexible polyimide plate laminated with a metal foil comprises a step of applying polyamic acid on the metal foil; half-drying the same; laminating a polyimide film thereon, and heating the laminate plate at≤100 Pa in two steps of temperature ranges of 150°C to 300°C and 330°C to 420°C; and imidizing polyamic acid while taking two hours or more for heating and holding times, respectively. The flexible polyimide plate laminated with the metal foil of all polyimide is yielded, which uses a heat resistant polyimide adhesive that is excellent in dimensional stability and excellent in curling resistance. COPYRIGHT: (C)2007,JPO&INPIT

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