PLATED GOLD FILM AND PRODUCTION METHOD THEREFOR
申请公布号:JP2007177291(A)
申请号:JP20050377355
申请日期:2005.12.28
申请公布日期:2007.07.12
发明人:FUJISHIGE MASATSUGU;ARAI SUSUMU;O MINE
分类号:C25D5/18;C25D3/48;C25D5/34
主分类号:C25D5/18
摘要:PROBLEM TO BE SOLVED: To provide a gold plating method for forming a plated gold film having superior hardness and electric conductivity, on an electric connection part. SOLUTION: This gold plating method includes: employing a non-cyanide gold plating bath containing a cationic additive; and supplying a pulse current having a pulse period of 5 msec to 300 msec and a duty ratio of 0.001 to 0.5 between a cathode of a body to be plated and an anode. Thus plated gold film is formed of a single metallic element, comprises crystallites with an average particle diameter of 17 nm to 25 nm, and has a Vickers hardness of 160 Hv or higher. COPYRIGHT: (C)2007,JPO&INPIT
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