FILM-FORMING APPARATUS USING SHEET PLASMA,申请号JP20050351576-传众专利搜索

FILM-FORMING APPARATUS USING SHEET PLASMA

申请公布号：JP2007154265(A)

申请号：JP20050351576

申请日期：2005.12.06

申请公布日期：2007.06.21

申请人：

SHIN MEIWA IND CO LTD

发明人：MARUNAKA MASAO;TSUCHIYA TAKAYUKI;TERAKURA ATSUHIRO;TAKEUCHI KIYOSHI

分类号：C23C14/34;H01L21/285;H05H1/48

主分类号：C23C14/34

摘要：<P>PROBLEM TO BE SOLVED: To provide a film-forming apparatus using sheet plasma, which can improve characteristics of a wiring film formed in a wiring groove on a substrate. <P>SOLUTION: The film-forming apparatus 100 using the sheet plasma comprises: a plasma gun 40 for projecting source plasma 22 toward a transportation direction; a sheet plasma deformation chamber 20 having a transportation space 21 which extends in the transportation direction; a pair of first magnetic field generation means 24A and 24B having the same pole sides arranged so as to sandwich the transportation space and face each other; a film-forming chamber 30 having a film-forming space 31 which communicates with the transportation space; and two pairs of second magnetic field generation means 32 and 33, of which each pair consist of opposite poles that are arranged so as to sandwich the film-forming space and face each other. The first magnetic field generation means 24A and 24B spread the source plasma 22 into a sheet shape along a principal surface S including the center by the magnetic field, while the source plasma 22 moves in the transportation space, and the second magnetic field generation means 32 and 33 deforms the sheet-shaped plasma 27 from the principal surface S into a convexed shape by the magnetic field, while the sheet-shaped plasma 27 moves in the film-forming space 31. <P>COPYRIGHT: (C)2007,JPO&INPIT