METHOD OF FORMING FILM PATTERN, DEVICE, ELECTRO-OPTICAL DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF MANUFACTURING ACTIVE MATRIX SUBSTRATE,申请号JP20060080303-传众专利搜索

METHOD OF FORMING FILM PATTERN, DEVICE, ELECTRO-OPTICAL DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF MANUFACTURING ACTIVE MATRIX SUBSTRATE

申请公布号：JP2007053333(A)

申请号：JP20060080303

申请日期：2006.03.23

申请公布日期：2007.03.01

申请人：

SEIKO EPSON CORP

发明人：HIRAI TOSHIMITSU;MORIYA KATSUYUKI

分类号：H01L21/3205;G02F1/1368;H01L21/288;H01L21/336;H01L29/786;H01L51/50

主分类号：H01L21/3205

摘要：PROBLEM TO BE SOLVED: To provide a method of forming a film pattern, where a film thickness difference between the film patterns to be formed is eliminated, for example, when arranging a functional liquid in a pattern formation region having some regions whose width is different. SOLUTION: The formation method of the film pattern comprises a process for laminating and forming a first bank layer 35 and a second one 36 on a substrate 18; and a process for forming a bank 34 having a pattern formation region 13, comprising a first pattern formation region 55 and a second pattern formation region 56 that is continuous to the first pattern formation region 55 and is wider than the region 55 by patterning the first and second bank layers 35, 36. The bank 34 is provided, where the contact angle of a sidewall 35s in the first bank layer 35 facing the pattern formation region 13 is less than 50°to a functional liquid containing water, and the contact angle of the second bank layer 36 is larger than that of the first bank layer 35. COPYRIGHT: (C)2007,JPO&INPIT