CHIP BONDING EQUIPMENT,申请号JP20050148425-传众专利搜索

CHIP BONDING EQUIPMENT

申请公布号：JP2006324598(A)

申请号：JP20050148425

申请日期：2005.05.20

申请公布日期：2006.11.30

申请人：

SHINKAWA LTD

发明人：SUMIYA OSAMU;TSUJI MASATO

分类号：H01L21/52;H05K13/04

主分类号：H01L21/52

摘要：<P>PROBLEM TO BE SOLVED: To further reduce the load of an Y table in chip bonding equipment. <P>SOLUTION: The die bonding device 10 includes an X table 20 to be driven at a low speed in an X axial direction, a Y table 30 to be driven at a high speed in a Y axial direction on an X table 20, and a Z driving motor for driving a bonding head 42 in a Z axial direction at a high speed. The Z driving motor includes a Z motor magnet 60 installed in an X table 20, and a Z motor driving coil 50 connected to a bonding head 42 so as to be movable to a Z axial direction along a Z rail 32 installed on the Y table 30. Driving currents are supplied to the Z motor driving coil 50 so that a Z axial driving force can be generated at a Z motor driving coil 50 according to the cooperation of the Z motor magnet 60 and the Z motor driving coil 50, and that the bonding head 42 can be moved to an XYZ three-dimensional arbitrary position. <P>COPYRIGHT: (C)2007,JPO&INPIT