MAIN CAUSE OF FAILURE ANALYZING SYSTEM,申请号JP20050145708-传众专利搜索

MAIN CAUSE OF FAILURE ANALYZING SYSTEM

申请公布号：JP2006324424(A)

申请号：JP20050145708

申请日期：2005.05.18

申请公布日期：2006.11.30

申请人：

OMRON CORP

发明人：SUGIHARA HISASHI;KISHIMOTO MAYUKO;SHIMIZU ATSUSHI;HIRAOKA YOSHIAKI

分类号：H05K3/34;H05K13/08

主分类号：H05K3/34

摘要：<P>PROBLEM TO BE SOLVED: To provide a main cause of failure analyzing system for realizing efficient inconvenience countermeasure/quality control by supporting the specifying of generating cause of the failure when lifting failure is generated in a printed board. <P>SOLUTION: The printed board is photographed in respective processes of at least solder printing process, component mounting process and reflow process among one series of processes for attaching a component to the printed board through soldering to accumulate the photographed images in respective processes into an image storing means, while associating them and inspect the lifting failure from the photographed image of reflow process. When the lifting failure is detected, the existence of solder bleeding is judged from the photographed image in the component mounting process and when there is the solder bleeding, the generating cause of the lifting failure is specified that the amount of solder paste in the solder printing process is excessive and the specified generating cause is outputted to an output means. <P>COPYRIGHT: (C)2007,JPO&INPIT