Verfahren und Vorrichtung zum Trennen eines plattenartigen Elements,申请号DE20041100768-传众专利搜索

Verfahren und Vorrichtung zum Trennen eines plattenartigen Elements

申请公布号：DE112004000768(T5)

申请号：DE20041100768

申请日期：2004.04.30

申请公布日期：2006.03.30

申请人：

TOKYO SEIMITSU CO., LTD.

发明人：SAKAYA, YASUYUKI;AZUMA, MASAYUKI

分类号：H01L21/301;B23K26/00;B23K26/40;B28D5/00;H01L21/00

主分类号：H01L21/301

摘要：<p>In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.</p>