Chemical mechanical polishing pad with micro-mold and production method thereof,申请号US20040952292-传众专利搜索

Chemical mechanical polishing pad with micro-mold and production method thereof

申请公布号：US2006068088(A1)

申请号：US20040952292

申请日期：2004.09.28

申请公布日期：2006.03.30

申请人：

JEONG HAE-DO;CHOI JAE-YOUNG;KIM HYOUNG-JAE;SEO HEON-DEOK;PARK BOUM-YOUNG;PARK JAE-HONG

发明人：JEONG HAE-DO;CHOI JAE-YOUNG;KIM HYOUNG-JAE;SEO HEON-DEOK;PARK BOUM-YOUNG;PARK JAE-HONG

分类号：B28B7/38

主分类号：B28B7/38

摘要：The present invention relates to a chemical mechanical polishing (CMP) pad with a micro-mold, and a production method thereof. More particularly, the present invention relates to a CMP pad with a micro-mold, in which the surface of the CMP pad is uniformly formed so as to avoid the glazing of the polishing pad, prevent a change in slurry flow and maintain the contact area between the polishing pad and a semiconductor wafer constant, thus allowing the wafer to be polished in a continuous and stable manner, and permitting the semiconductor wafer to be polished into the desired shape, as well as a production method thereof.