SEMICONDUCTOR DEVICE,申请号JP20040261910-传众专利搜索

SEMICONDUCTOR DEVICE

申请公布号：JP2006080258(A)

申请号：JP20040261910

申请日期：2004.09.09

申请公布日期：2006.03.23

申请人：

TOSHIBA CORP

发明人：WATABE KAZUHIRO

分类号：H01L25/18;H01L25/065;H01L25/07

主分类号：H01L25/18

摘要：PROBLEM TO BE SOLVED: To provide a semiconductor module package structure of small package dimension, in which a plurality of semiconductor pellets are laminated regardless of external dimension. SOLUTION: Semiconductor pellets 1 are mounted by bump-connection provided with a plurality of wiring boards 3a, 3b, and 3c comprising board connection pads 6a, 6b, and 6c, a wiring board 3 for an external connection terminal that comprises, with the plurality of laminated wiring boards, an external connection terminal 10 on one surface and a board connection pad 6 where the external connection terminal is electrically connected through a conductive via 9 on the other surface, and a bonding wire 7 for electrically connecting adjoining wiring boards with the board connection pads among the plurality of laminated wiring boards and the wiring board for external connection. The board connection pad is at least partially exposed even if the wiring boards and the wiring board for external connection are laminated. So, at least a part of the board connection pad is different from others in size or shape so that the bonding wire connect the board connection pads. COPYRIGHT: (C)2006,JPO&NCIPI