Thermoplastic polyamide moulding compositions,申请号US20050124015-传众专利搜索

Thermoplastic polyamide moulding compositions

申请公布号：US2005250886(A1)

申请号：US20050124015

申请日期：2005.05.06

申请公布日期：2005.11.10

申请人：

STOEPPELMANN GEORG;KETTL RALPH;SCHWITTER PAUL

发明人：STOEPPELMANN GEORG;KETTL RALPH;SCHWITTER PAUL

分类号：B32B27/34;C08J3/20;C08K3/16;C08K3/22;C08K5/00;C08L77/00;C08L101/00;F16L11/04;F16L11/11;F16L11/12;(IPC1-7):C08K5/16;C08K5/49

主分类号：B32B27/34

摘要：The invention relates to thermoplastic polyamide moulding compositions containing: (A) at least 20% by wt. polyamide and/or at least one copolymer containing at least 20% by wt. polyamide structural units; (B) 0.01% by wt. to 2% by wt., relative to the polyamide portion and/or the portion of polyamide structural units, of the composition of a copper-containing stabiliser; and (C) 0.01% by wt. to 3% by wt., relative to the polyamide portion and/or the portion of polyamide structural units of the composition, of at least one organic compound containing metal complexing groups, so that the copper ions are present in complexed form through binding to the metal-complexing groups. These moulding compositions may be used as coating material for coolant lines.