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半导体构造制程之临界尺寸控制

申请公布号:TW200525324

申请号:TW093125023

申请日期:2004.08.19

申请公布日期:2005.08.01

申请人:
台湾积体电路制造股份有限公司

发明人:陈方正;许立德;曾怡诚;许琼文;陈宗权;苏斌嘉

分类号:G05D5/00

主分类号:G05D5/00

代理人:蔡坤财

地址:新竹市新竹科学工业园区力行六路8号

摘要:一种控制蚀刻后结构之临界尺寸的方法,其至少包含如下的步骤。于底材上形成一硬罩幕,并量测硬罩幕的临界尺寸,以及使用硬罩幕已量测的临界尺寸来控制底材上电路图形之临界尺寸的修整操作。

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