Nickel-gold plating exhibiting high resistance to corrosion,申请号US20020204861-传众专利搜索

Nickel-gold plating exhibiting high resistance to corrosion

申请公布号：US6872470(B2)

申请号：US20020204861

申请日期：2002.08.26

申请公布日期：2005.03.29

申请人：

IBIDEN CO., LTD.

发明人：MINAMIKAWA YOSHIHIRO

分类号：C23C28/02;(IPC1-7):B32B15/01;C23C28/00

主分类号：C23C28/02

摘要：A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential being brought close to that of the gold plating layer (3) through the reduction of the sulfur content of the nickel plating layer; or which has a first nickel plating layer (6) formed on a base metal, a second nickel plating layer (7) formed on the first nickel plating layer and a gold plating layer formed thereon, characterized in that the first nickel plating layer has a corrosion potential nobler (higher) than that of the second nickel plating layer. The nickel-gold plating exhibits only a mild local cell phenomenon between the gold plating layer and a nickel plating layer directly thereunder even under corrosive conditions, which leads to retardation of the corrosion through pitting and thus to a satisfactory durability of the plating with relatively thin respective plating layers. Accordingly, the nickel-gold plating achieves a high resistance to corrosion with little impairment of production cost or productivity.