HEATER ASSEMBLY OF SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT FOR LENGTHENING LIFETIME OF HEATER PLATE,申请号KR20030052180-传众专利搜索

HEATER ASSEMBLY OF SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT FOR LENGTHENING LIFETIME OF HEATER PLATE

申请公布号：KR20050013688(A)

申请号：KR20030052180

申请日期：2003.07.29

申请公布日期：2005.02.05

申请人：

SAMSUNG ELECTRONICS CO., LTD.

发明人：SEO, MOON MIN

分类号：H01L21/205;(IPC1-7):H01L21/205

主分类号：H01L21/205

摘要：PURPOSE: A heater assembly of semiconductor device fabrication equipment is provided to lengthen a lifetime of a heater plate by maintaining a connecting state between a heating coil and an electric wire from oxidation. CONSTITUTION: A case(42) is used for partitioning an inner part of a heater assembly. A charging material layer(44) is charged into an inner part of the case. The charging material layer is formed with an insulating material. A heating coil(50) is covered with the charging material layer and is used for generating the heat. An electric wire(52) is welded at an end part of the heating coil and an end part of an electrode terminal. A cover(54) is used for covering each periphery of welded parts of the heating coil and the electric wire.