Heat conductive sheet and method of producing the sheet
申请公布号:US6794030(B1)
申请号:US20000719893
申请日期:2000.12.19
申请公布日期:2004.09.21
发明人:OKADA MITSUHIKO;UCHIYA TOMOAKI
分类号:H01L23/373;(IPC1-7):B32B7/12
主分类号:H01L23/373
摘要:The invention is directed toward a heat conductive sheet that has flexibility, can follow a specific shape such as ruggedness and curvature, which can therefore insure high adhesion and, at the same time, excellent heat releasing property, is free from the occurrence of wrinkle and rupture or elongation, even when the thickness is decreased, and is excellent in formability of sheet formation and in bonding work. Such heat conductive sheet includes a substrate and a heat conductive resin layer applied to at least one surface of the substrate, wherein the heat conductive resin layer is constituted as to contain a binder resin and a heat conductive filler dispersed in the binder resin.
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