Lead frame for an electronic component package,申请号EP20040250482-传众专利搜索

Lead frame for an electronic component package

申请公布号：EP1447847(A2)

申请号：EP20040250482

申请日期：2004.01.29

申请公布日期：2004.08.18

申请人：

ATLANTIC TECHNOLOGY (UK) LTD.

发明人：RAE, ANGUS;PROTHEROE, ROBERT RHYS

分类号：H01L21/56;H01L23/31;H01L23/495

主分类号：H01L21/56

摘要：A lead frame 10 for use in a leadless package such as a quad flat non-leaded package (QFN), comprises an array of sites 11 for receiving respective electronic component devices 15 on the upper surface of the frame 10 and a plurality of rails 12 arranged in a grid, with each site 11 being disposed in a respective region within the grid. The rails 12 carry lead-fingers 14 which project into respective sites 11 and the lower surface of the frame 10 is partially etched over regions R1, R2 extending along lateral edges of the rails 12 from which the lead-fingers extend, the partially etched regions R1, R2 extending partially into the lead-fingers. <??>An unetched region M extends along each rail 12 and acts to strengthen the rails 12 and thus prevents the rails 12 from flexing unduly under the applied pressure during wire bonding of the component 15. <IMAGE>