METHOD FOR SEPARATING SEMICONDUCTOR WAFER,申请号JP20020360957-传众专利搜索

METHOD FOR SEPARATING SEMICONDUCTOR WAFER

申请公布号：JP2004193417(A)

申请号：JP20020360957

申请日期：2002.12.12

申请公布日期：2004.07.08

申请人：

DISCO ABRASIVE SYST LTD

发明人：MORI TAKASHI

分类号：H01L21/683;H01L21/301;H01L21/68;(IPC1-7):H01L21/301

主分类号：H01L21/683

摘要：PROBLEM TO BE SOLVED: To effectively separate a wafer into semiconductor chips by grinding and transfer the chips to a pickup tape in a so-called tip dicing technology, thereby enhancing the productivity. SOLUTION: A method for separating a semiconductor wafer, in which the semiconductor wafer formed with a plurality of circuits on the surface by partitioning by a street is divided into discrete semiconductor chips for every circuit, comprises: the separation trench forming step S1 of forming a separation trench of a depth corresponding to the thickness of the semiconductor chip in the street; the protection member coating step S2 of coating a protection member on the surface of the semiconductor wafer; the separating step S3 of grinding the back of the semiconductor wafer to expose the separation trench from the back to separate into individual semiconductor chips; the housing step S4 of housing, in a wafer cassette, the semiconductor chips under a condition that they are coated with the protection member to maintain the external shape of the semiconductor wafer; and the transfer preparing step S5 of supplying the wafer cassette housing the semiconductor chips to a transfer device for transferring the semiconductor chips to the pickup tape. COPYRIGHT: (C)2004,JPO&NCIPI