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HARDENING ACCELERATOR, PRODUCTION METHOD FOR HARDENING ACCELERATOR, EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
申请公布号：JP2004168947(A)
申请号：JP20020338555
申请日期：2002.11.21
申请公布日期：2004.06.17
发明人：NONAKA HIROTAKA;HIROSE HIROSHI;SUGAWARA MAKI
分类号：C07B61/00;C07F9/54;C08G59/40;H01L23/29;H01L23/31;(IPC1-7):C08G59/40
主分类号：C07B61/00
摘要：PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors having excellent hardenability, storability and fluidity and semiconductor devices that are sealed with the hardened epoxy resin and has excellent resistance to solder heat cracking and high humid resistance reliability. SOLUTION: The epoxy resin composition for sealing semiconductors comprises (A) a compound bearing two or more epoxy groups in one molecule, (B) a compound bearing two or more phenolic hydroxy groups in one molecule, (C) a phosphonium inner salt and (D) an inorganic filler as essential components, and semiconductor devices sealed with the cured products of the resin composition are disclosed. COPYRIGHT: (C)2004,JPO
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