Method of assembling and testing an electronics module

申请公布号：US2004096994(A1)

申请号：US20030609263

申请日期：2003.06.26

申请公布日期：2004.05.20

申请人：

FORMFACTOR, INC.

发明人：ELDRIDGE BENJAMIN N.

分类号：G01R31/28;G01R1/073;G01R31/3185;G01R31/319;(IPC1-7):H01L21/66

主分类号：G01R31/28

摘要：An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed.. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

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