METHOD OF MANUFACTURING SEMICONDUCTOR,申请号JP20020292613-传众专利搜索

METHOD OF MANUFACTURING SEMICONDUCTOR

申请公布号：JP2004128339(A)

申请号：JP20020292613

申请日期：2002.10.04

申请公布日期：2004.04.22

申请人：

RENESAS TECHNOLOGY CORP;HITACHI TOKYO ELECTRONICS CO LTD

发明人：MAKI HIROSHI;WADA EIJI

分类号：H01L21/52;(IPC1-7):H01L21/52

主分类号：H01L21/52

摘要：PROBLEM TO BE SOLVED: To reduce cracking or defective bonding of a chip when the chip is subject to die-bonding by using a collet. SOLUTION: A semiconductor chip 2 is sucked and held by a collet 7A wherein a plurality of suction holes 7b of about 1mm or less in diameter are formed in a suction part 7a having almost the same area as the semiconductor chip 2, or a collet 7B wherein the suction part 7a is entirely made of porous material 7c, e.g. ceramic-based material or synthetic resin or the like. Then, the rear surface of the semiconductor chip 2 held by the collet 7B is pressed toward the main surface of a wiring board, thereby die-bonding the semiconductor chip 2. COPYRIGHT: (C)2004,JPO