COPPER FOIL COMPOSITE MATERIAL FOR PRINTED WIRING BOARD,申请号JP20020285339-传众专利搜索

COPPER FOIL COMPOSITE MATERIAL FOR PRINTED WIRING BOARD

申请公布号：JP2004127954(A)

申请号：JP20020285339

申请日期：2002.09.30

申请公布日期：2004.04.22

申请人：

FURUKAWA TECHNO RESEARCH KK;FURUKAWA CIRCUIT FOIL KK

发明人：NAKAOKA TADAO

分类号：B32B15/08;H05K1/03;H05K3/00;(IPC1-7):H05K3/00

主分类号：B32B15/08

摘要：PROBLEM TO BE SOLVED: To provide a copper foil composite material for a printed wiring board consisting of a copper foil and a supporting plate in which the supporting plate can be reused without causing any waving or crumpling in the copper foil during the hot press, and the quantity of copper foil being used is minimized. SOLUTION: The copper foil for printed wiring board and an arbitrary sheet are pasted like a bag with the shiny side being directed inward and a metallic or plastic supporting plate is encapsulated in the bag. The copper foil composite article for printed wiring board is provided, on at least on side in the bag, with a linear auxiliary bag cutter having at least one end exposed to the outside of the bag. COPYRIGHT: (C)2004,JPO