LIQUEFYING GOLD POWER OF 0.3 mu OR UNDER BY THE USE OF LIQUID ADHESIVES OR PAINTS WITH HIGH ELECTRIC CONDUCTIVITY, AND USING IT FOR ELECTRONIC CIRCUIT PRINTING OR INKJET WIRING,申请号JP20030200113-传众专利搜索

LIQUEFYING GOLD POWER OF 0.3 mu OR UNDER BY THE USE OF LIQUID ADHESIVES OR PAINTS WITH HIGH ELECTRIC CONDUCTIVITY, AND USING IT FOR ELECTRONIC CIRCUIT PRINTING OR INKJET WIRING

申请公布号：JP2004127921(A)

申请号：JP20030200113

申请日期：2003.06.18

申请公布日期：2004.04.22

申请人：

SOGO MUSEN:KK

发明人：KOJIMA YUKIMASA

分类号：H05K1/09;H01B1/22;H01L21/288;(IPC1-7):H01B1/22

主分类号：H05K1/09

摘要：PROBLEM TO BE SOLVED: To realize the nanofabrication of an electronic circuit printing or an inkjet wiring for printed boards, screens, films, semiconductors, etc. SOLUTION: To develop the gold powder of 0.3 microns or under and use liquid adhesives or paints with high electric conductivity with which the gold powder has been formulated. COPYRIGHT: (C)2004,JPO