TREATMENT APPARATUS OF SUBSTRATE,申请号JP20020218322-传众专利搜索

TREATMENT APPARATUS OF SUBSTRATE

申请公布号：JP2004063201(A)

申请号：JP20020218322

申请日期：2002.07.26

申请公布日期：2004.02.26

申请人：

SHIBAURA MECHATRONICS CORP

发明人：NISHIBE YUKINOBU;ISO AKINORI

分类号：F26B5/00;H01L21/027;H01L21/304;H01L21/306;H05F3/02;(IPC1-7):H05F3/02

主分类号：F26B5/00

摘要：PROBLEM TO BE SOLVED: To provide an interference treatment apparatus for preventing a circuit pattern formed on a substrate from being damaged by static electricity when the substrate is subjected to a drying treatment with an air knife. SOLUTION: The treatment apparatus equipped with a drying treatment chamber 6 for drying a substrate by ejecting gas to the substrate further comprises conveying rollers 12 for conveying the substrate to the drying treatment chamber, an air knife 21 provided in the drying treatment chamber and ejecting the air to the substrate conveyed by the conveying rollers to dry the substrate, and a first conductive member 23 and a first grounding cable 24 for preventing static electricity generated in the drying treatment chamber upon the drying treatment of the substrate from remaining in the treatment chamber. COPYRIGHT: (C)2004,JPO