申请公布号:JP3480570(B2)
申请号:JP20010142667
申请日期:2001.05.14
申请公布日期:2003.12.22
分类号:H05K3/34;H01L21/60;H01L21/822;H01L23/32;H01L27/04;(IPC1-7):H01L21/60
主分类号:H05K3/34
摘要:<p>PROBLEM TO BE SOLVED: To easily remove a semiconductor chip having a flip-chip structure. SOLUTION: A semiconductor device comprises a resistor film 2 formed as a heating element on an upper surface of the semiconductor chip 1 mounted on a circuit board 5 via solder bumps 6. A method for removing the semiconductor chip comprises the steps of supplying a current to the resistor film 2 via electrodes 4, and heating the film 2. The method further comprises the step of raising the chip 1 from the board 5 when the heated bump 6 is melted.</p>
Topical cosmetic and pharmaceutical compositions.
Floor for a motor vehicle, particularly a driver's cabin floor.
Process for purifying waste gazes from CVD-processes.
Dental filling material and process for its preparation.
Zirconyl phosphate ceramics, process for their production and their use.
Air nozzle for interiors, particularly for the interior of a motor vehicle.
Device for reducing vehicle body oscillations.
Pyrethroids, process for their preparation and their use in combating pests.
HERBICIDE AND SAPROPHYTICIDAL SPECIFIC
METHOD OF OBTAINING NOVEL DERIVATIVES OF DIOXAZOCINE
SYSTEM FOR PREVENTING ENCRUSTATION OF EVAPORATORS, IN PARTICULAR THOSE ISE IN SUGAR MAKING
METHOD OF OBTAINING A FLOOR AND WALL LINING
FLOW VELOCITY MEASURING PICK-UP FOR PIPELINES
METHOD OF OBTAINING LACQUER COMPOSITIONS CONTAINING HYDROXY COMPOUNDS