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申请公布号:JP3480570(B2)

申请号:JP20010142667

申请日期:2001.05.14

申请公布日期:2003.12.22

分类号:H05K3/34;H01L21/60;H01L21/822;H01L23/32;H01L27/04;(IPC1-7):H01L21/60

主分类号:H05K3/34

摘要:<p>PROBLEM TO BE SOLVED: To easily remove a semiconductor chip having a flip-chip structure. SOLUTION: A semiconductor device comprises a resistor film 2 formed as a heating element on an upper surface of the semiconductor chip 1 mounted on a circuit board 5 via solder bumps 6. A method for removing the semiconductor chip comprises the steps of supplying a current to the resistor film 2 via electrodes 4, and heating the film 2. The method further comprises the step of raising the chip 1 from the board 5 when the heated bump 6 is melted.</p>

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