Method and plant for laser cutting with dual-flow and double-focus cutting head,申请号US20010013533-传众专利搜索

Method and plant for laser cutting with dual-flow and double-focus cutting head

申请公布号：US6664504(B2)

申请号：US20010013533

申请日期：2001.12.13

申请公布日期：2003.12.16

申请人：

L'AIR LIQUIDE - SOCIETE ANONYME A DIRECTOIRE ET CONSEIL DE SURVEILLANCE POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

发明人：BERTEZ CHRISTOPHE

分类号：B23K26/06;B23K26/067;B23K26/073;B23K26/14;(IPC1-7):B23K26/00

主分类号：B23K26/06

摘要：Method and plant for cutting or welding by a laser beam with dual-flow and double-focus cutting head. The plant includes a laser generator to generate at least one main laser beam (10), a first optical element (1) enabling the main laser beam (10) to be divided into at least two subsidiary laser beams (11, 12), a first outlet nozzle (4) through which one (11) of the subsidiary laser beams passes, and a second outlet nozzle (3) through which the other (12) of the subsidiary laser beams passes, the first and second outlet nozzles (4, 3) being approximately coaxial one with the other. In this way, it is possible to focus the central beam (11) onto a focusing point (PF) by a first focusing element (1), such as a lens, and the other beam (12) onto an annular focusing zone (ZAF).