Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions,申请号US20020161707-传众专利搜索

Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions

申请公布号：US6649516(B2)

申请号：US20020161707

申请日期：2002.06.05

申请公布日期：2003.11.18

申请人：

KABUSHIKI KAISHA TOSHIBA

发明人：ASAKAWA KOJI;HOTTA YASUYUKI;MATAKE SHIGERU;HIRAOKA TOSHIRO

分类号：H05K1/03;H05K3/00;H05K3/10;H05K3/18;H05K3/42;(IPC1-7):H05K3/10

主分类号：H05K1/03

摘要：Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20 to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.