High performance cold plate for electronic cooling,申请号US20010803562-传众专利搜索

High performance cold plate for electronic cooling

申请公布号：US6634421(B2)

申请号：US20010803562

申请日期：2001.03.09

申请公布日期：2003.10.21

申请人：

SATCON TECHNOLOGY CORPORATION

发明人：OGNIBENE EDWARD J.;HOLMANSKY EVGENY N.;JOHNSON DOUGLAS L.;DONEGAN KEVIN J.

分类号：F25D9/00;F28F3/02;F28F3/12;H01L23/473;H05K7/20;(IPC1-7):F28F3/00;F28F7/02;F28F3/08

主分类号：F25D9/00

摘要：A fluid cooling device, and a method for manufacturing the fluid cooling device, are disclosed. The fluid cooling device includes a plurality of cold plate members, each having a plurality of imperforate plate portions and perforate portions arranged in a line; and, at least one connector for connecting the plate portions together at one end thereof. The cold plate members are arranged in a stack, wherein respective plate portions of each cold plate member are in registration with perforate portions formed in its adjacent cold plate members in the stack. The fluid cooling device can provide very high heat transfer by close clearance laminar developing flow, thereby increasing the thermal performance of the fluid cooling device while maintaining low pressure drop. The method for manufacturing the fluid cooling device includes forming a plurality of cold plate members from a planar metal tape, or thin layer stock; positioning the cold plate members relative to each other so that the respective imperforate plate portions of each cold plate member are in registration with the perforate portions formed in adjacent cold plate members; and joining each cold plate member with the adjacent cold plate members.