APPARATUS FOR CLEANING WAFER
申请公布号:KR20030035035(A)
申请号:KR20010066895
申请日期:2001.10.29
申请公布日期:2003.05.09
发明人:NAM, CHANG HYEON
分类号:H01L21/304;B08B3/12;H01L21/00;(IPC1-7):H01L21/304
主分类号:H01L21/304
摘要:PURPOSE: An apparatus for cleaning a wafer is provided to protect the wafer from contaminant by selectively performing a spin dry process or an isopropyl alcohol(IPA) reduced pressure dry process according to a pattern condition of the wafer. CONSTITUTION: A plurality of cleaning solution supply units supply a cleaning solution to a chemical bath(11) having a wafer mounting unit on which the wafer is mounted. A plurality of exhausting units(26) selectively exhaust the chemical solution supplied by the cleaning solution supply unit after a cleaning process. The wafer mounting unit in side the chemical bath is capable of rotating. An IPA vapor supply unit(30) is additionally installed in a side of the chemical bath so that either one of a spin dry process or an IPA reduced pressure dry process is selectively performed according to the pattern condition of the wafer.
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