Semiconductor wafer processing apparatus
申请公布号:US2003082914(A1)
申请号:US20020315976
申请日期:2002.12.11
申请公布日期:2003.05.01
发明人:KOMA YUTAKA;ARITA KIYOSHI;HAJI HIROSHI;IWAI TETSUHIRO
分类号:H01L21/304;H01L21/302;H01L21/677;H01L21/683;(IPC1-7):H01L21/302;H01L21/461
主分类号:H01L21/304
摘要:A semiconductor wafer processing apparatus grinds a surface of a semiconductor wafer by mechanical grinding, and then removes a damaged layer in the ground surface. In the processing apparatus, a grinding portion, a precenter portion, a wafer cleaning portion, plasma treatment portions, and magazines are arranged radially about an origin of a polar coordinate system of a third wafer transport portion having a robot mechanism, and their positions of arrangement are set such that the origin is located on lines of extension of wafer carry-in and carry-out center lines of the plasma treatment portions. Thus, the number of changed grippings of the semiconductor wafer can be minimized to prevent breakage of the semiconductor wafer. Moreover, transfer of the semiconductor wafer between the respective portions can be covered by the single robot mechanism, and the equipment can be made compact.
METHOD OF INTEGRATING PEALD TA-CONTAINING FILMS INTO CU METALLIZATION
HERSTELLUNGSVERFAHREN FÜR GEWEBE
ACYCLIC AMINE INHIBITORS OF 5'-METHYLTHIOADENOSINE PHOSPHORYLASE AND NUCLEOSIDASE
DEVICE FOR FASTENING A WINDSHIELD WIPER SYSTEM TO A MOTOR VEHICLE
APPARATUS FOR INTERFACING AIR CIRCUIT BREAKER
MEDICAL REFRIGERATING SHOW-CASE
REGULATOR CIRCUIT FOR GENERATING OF STABILITY VOLTAGE
REFLECTIVE SHEET AND THE METHOD OF PREPARING IT
THIS DISGUISE FORM OF BAR IS USED FOR MAKING GLASS PANNEL CURTAIN WALL IN BUILDING
CLEANING ROBOT MOUNTED WITH AIR CLEANER
MELTING FURNACE, IN PARTICULAR ELECTRIC ARC FURNACE
NOVEL SOFT CHEWABLE, TABLET, AND LONG-ACTING INJECTABLE VETERINARY ANTIBIOTIC FORMULATIONS
MERGED LASER AND PHOTOGRAMMETRY MEASUREMENT USING PRECISE CAMERA PLACEMENT