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MOISTURE-CURABLE EPOXY RESIN COMPOSITION

申请公布号:JP2003073455(A)

申请号:JP20010263289

申请日期:2001.08.31

申请公布日期:2003.03.12

申请人:
SANYO CHEM IND LTD

发明人:SAITO HIDEAKI;HONDO FUMIAKI

分类号:C08K5/103;C08G59/50;C08K5/20;C08K5/46;C08L63/00;C08L71/02;C08L83/12;(IPC1-7):C08G59/50

主分类号:C08K5/103

摘要:PROBLEM TO BE SOLVED: To provide a moisture-curable epoxy resin composition, capable of moisture-curing at a normal or lower temperature, excellent in whitening resistance, and further usable as one part composition. SOLUTION: This moisture-curable epoxy resin composition is composed of an epoxy resin (A), a specific ketimine-based latent curing agent (B) and a compound having a specific heterocycle.

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