Circuit arrangement e.g. for detecting position of elevator doors, comprises modules mounted in a ball grid array housing on a circuit board

申请公布号：DE20114939(U1)

申请号：DE2001214939U

申请日期：2001.09.11

申请公布日期：2003.01.30

申请人：

IC-HAUS GMBH

分类号：H05K1/18;H05K3/34;(IPC1-7):H05K3/34

主分类号：H05K1/18

摘要：<p>The circuit arrangement has at least one module or chip (20) mounted on a circuit board (50). The chip is arranged in a ball grid array (BGA) housing (10). The BGA housing is arranged on an end (52) of the circuit board and is electrically connected to the circuit board. The BGA housing may have a groove (13) to receive a section of the end of the circuit board. The end of the circuit board may have a projection (54) to engage in a recess (15) of the housing to prevent the circuit board being shifted laterally.</p>

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