METHOD OF GREY LEVEL COMPENSATION AND SELECTIVE WAFER-DEFECT INSPECTION FOR PATTERNS AND RECORDING MEDIUM RECORDED THEREOF,申请号KR20010025578-传众专利搜索

METHOD OF GREY LEVEL COMPENSATION AND SELECTIVE WAFER-DEFECT INSPECTION FOR PATTERNS AND RECORDING MEDIUM RECORDED THEREOF

申请公布号：KR20020085995(A)

申请号：KR20010025578

申请日期：2001.05.10

申请公布日期：2002.11.18

申请人：

SAMSUNG ELECTRONICS CO., LTD.

发明人：CHOI, SANG BONG;JUN, CHUNG SAM;JUN, SANG MUN;KIM, HYEONG JIN;LEE, DONG CHUN;RYU, SEONG GON

分类号：G01N21/956;G06T1/00;G06T5/00;G06T7/40;H01L21/66

主分类号：G01N21/956

摘要：PURPOSE: A method of grey level compensation and selective wafer-defect inspection for patterns and recording medium recorded thereof are provided to compensate different brightness of each parts of a wafer, detect selective defects for different patterns, and form a recoding medium for recording a method for correcting the brightness and a method for detecting the selective defects. CONSTITUTION: A surface of a wafer including an X region having the first brightness and a Y region having the second brightness is divided into a plurality of pixels having a predetermined size. Gray level values for each pixel are defined. A mean value and standard deviation of the gray level values of each region are obtained according to the X region and the Y region. The mean value and the standard deviation of the gray level values for the X region is identical with the mean value and the standard deviation of the gray level values for the Y region by performing a correction process for correcting the gray level values for all pixels of the X region.